Senior Engineer, Staff / Manager (Wet Etch/Electroplating)

Skip to main contentOur CompanyOur BusinessSearch for JobsJoin Talent NetworkFAQsProfileEnglishSign InSingle PositionView All JobsSenior Engineer, Staff / Manager (Wet Etch/Electroplating)Singapore, Central Singapore, Singapore No longer accepting applications.Job ID3090872As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.Job Responsibilities:Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processesManage and develop a team of engineers and technicians in a high‑volume manufacturing environmentDrive excellence in output, quality, cost, equipment uptime, and safetyEnsure robust process control, stability, and integration across wet etch and plating operationsLead root‑cause investigations for process, quality, and equipment issues and drive permanent corrective actionsDrive yield improvement, scrap reduction, and defect reduction through data‑driven analysisEnsure high equipment availability and reliability, particularly for wet benches and plating toolsApply and sustain SPC and statistical analysis tools to monitor and improve process performanceActively contribute to continuous improvement programs to resolve chronic manufacturing or quality issuesWork closely with cross‑functional teams including Process Integration, Equipment, Quality, and ManufacturingProvide technical and operational leadership during crisis situations impacting fab operationsEnsure strict compliance with EHS requirements, quality systems, cleanroom discipline, and wafer fab protocolsJob RequirementsBachelor’s degree in Engineering, Chemistry, Materials Science, Physics, or related disciplineMinimum 10 years of relevant experience in semiconductor wafer fabricationStrong hands‑on technical expertise in Wet Etch, Electroplating, and related wet processesPrior experience in high‑volume semiconductor manufacturing within an MNC environmentStrong understanding of: Process integrationStatistical Process Control (SPC)Yield improvement and scrap reduction methodologiesEquipment maintenance strategies, particularly for wet benches and plating toolsProven people management experience, including coaching, talent development, succession planning, and manpower deploymentDemonstrated ability to lead root‑cause analysis and corrective action implementationStrong sense of ownership with the ability to work effectively under pressureHands‑on leadership style with strong problem‑solving and decision‑making capabilitiesExcellent communication and cross‑functional collaboration skillsFamiliarity with statistical analysis tools, Excel, PowerPoint, and WordStrong commitment to Environmental Health & Safety (EHS), quality systems, and fab compliance