Principal Subsystem Engineer (Design or DV)
The AISoC silicon team is seeking a Principal Subsystem Engineer (Design or DV) to deliver premium-quality designs once considered impossible. We are responsible for delivering cutting-edge, custom Intellectual Property (IP) and System on Chip (SoC) designs that can perform complex and high-performance functions in an extremely efficient manner. Team is currently looking for subsystem design and DV leads. Technically lead one or more Subsystems as a design or DV engineer. Collaborate across teams on vertical and horizontal reuse of components. Provide technical leadership through mentorship and teamwork. Work effectively with Architecture, Design, DV, PD, DFT, firmware, and post-silicon teams to debug system-level issues and deliver silicon from concept through bring-up. Deep understanding of many of the following: complex subsystems (such as PCIE, HBM, imaging or control), fabrics, AMBA AXI/CHI protocols, DMA engines, NoCs, and high-throughput data buffering and movement. Design includes but not limited to - Bandwidth, latency, utilization, and power tradeoffs while driving synthesis, timing constraints, floor-planning awareness, and performance tuning (Design). Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience. Experience debugging Register Transfer Level (RTL) designs as well as simulation and/or emulation environments. Experience with design quality and static checks, DFT implementation and hand off to physical design. Experience in design or DV domains. 8+ years expertise in digital logic design including microarchitecture specification development, RTL coding in Verilog/System Verilog, design verification collaboration, and CDC/Lint closure. Experience with verification for multiple product cycles from definition to Silicon, including writing test plans, developing tests, debugging failures and coverage signoff in C++ and Universal Verification Methodology (UVM). Experience of working on Artificial Intelligence (AI) / Machine Learning (ML) SoCs. Experience in Scripting language such as Python or Perl.