Mechanical Program Lead Engineer

Lead end-to-end design and delivery of complex subsystems and system-level mechanical architectures for semiconductor processing equipment (e.g., process chambers, chemical delivery, frames, thermal subsystems, automation interfaces, and motion-controlled assemblies). Drive technical planning: scope definition, requirements decomposition, concept selection, and risk mitigation using engineering calculations, dFMEA, and DfX. Own detailed design execution: design reviews, tolerance strategy (GD&T), drawing/model release, and configuration/change management. Plan and lead verification and validation: feasibility builds, test plan development, instrumentation strategy, data review, and design closure. Partner with cross-functional global teams (electrical, systems, software, process, program management, product support, quality) to integrate subsystems and deliver program milestones. Engage suppliers and manufacturing engineering to ensure design for manufacturability/assembly/service, cost targets, quality, and on-time delivery. Lead structured troubleshooting and reliability improvements (RCCA/8D/5-Why) for field and factory issues impacting safety, uptime, yield, and productivity. Provide technical mentorship and review for junior engineers; set expectations for analysis quality, documentation, and engineering rigor. Develop and continuously improve design standards, Best Known Methods (BKMs), and reusable design content. Education: B.E. / B.Tech / M.E. / M.Tech in Mechanical Engineering Experience: 8 to 12 years of relevant experience, preferably in semiconductor equipment engineering Strong mechanical design fundamentals with hands-on ownership from concept through release for high-reliability hardware. Expertise selecting materials and finishes for semiconductor environments (metals, ceramics, quartz, polymers, coatings) with contamination and thermal considerations. Proficiency in engineering analyses: structural/FEA, thermal/heat transfer, stress and vibration, and fluid/gas flow as applicable. Experience with requirements definition and verification/validation planning at system and subsystem level. Working knowledge of DoE, FMEA, and DfX (cost, manufacturability, assembly, reliability, safety, testing, and serviceability). Strong documentation discipline aligned with Lam/SEMI practices, including GD&T and configuration control. Structured problem-solving experience (RCCA, 8D, 5-Why, Fishbone) with a track record of closing issues with data. Broad manufacturing knowledge (machining, sheet metal, welding, polymers) and exposure to additive manufacturing. Strong communication and stakeholder management skills; ability to influence across teams and drive decisions in design/program reviews.