Package/System Design Solution Engineer, Senior

Skip to main contentOur CompanyOur BusinessSearch for JobsJoin Talent NetworkFAQsProfileEnglishSign InSingle PositionView All JobsPackage/System Design Solution Engineer, SeniorHsinchu City, Taiwan No longer accepting applications.Job ID3093275The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...).Job responsibilities for this position include package selection, package design, and package electrical modeling. This involves optimizing system co-design of IC-PKG-PCB die with keeping in mind package footprint/height constraints, IC floor-planning, PCB, signal integrity, power distribution network, and thermal constraints.Additional responsibilities:IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignmentSystem level co-design methodology of IC, Package and PCB/BoardConcept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level costPackage design flow methodology implementing high speed interface SI constraints for impedance, IR drop, cross-talk.Package design flow methodology implementing power distribution network (PDN) constraints for high frequency processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levelsWorking with marketing/IC/product teams on competitive analysis and road mapping package technology for future productsMinimum QualificationsBachelor's degree in Engineering, Information Systems, Computer Science, or related field.3+ years Hardware Engineering experience or related work experience.Preferred QualificationsExperience in IC package and/or PCB selection, design, and layout experience - Experience in Pinmap optimization of optimal PCB designStrong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theoryWorking knowledge of die floor planning, IO placement, and bump placementWorking knowledge of Chip, Package and PCB co-design methodologyFamiliar with assembly and substrate manufacturing processFamiliar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.Familiar with PCB stack-up and breakout strategyEducational RequirementsBachelor's Electrical Engineering and/or Mechanical EngineeringPreferred: Master's, Electrical Engineering