Principal Mechanical Engineer

Principal Mechanical Engineer LocationBengaluru, IndiaEmployment TypeFull timeLocation TypeOn-siteDepartmentEngineeringPrincipal Mechanical Engineer – OSFP Module DesignAbout Lumilens At Lumilens, we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing—faster, cooler, and massively more efficient. Join our experienced team to help shape the next generation of high-speed optical connectivity. Position SummaryWe are seeking an experienced Principal Mechanical Engineer to lead the architecture, design, development, and industrialization of next-generation high-speed optical transceiver modules, including 800G, 1.6T, and future pluggable platforms based on the OSFP ecosystem. This role requires deep expertise in high-speed electro-mechanical packaging, thermal management, precision tolerance engineering, EMI/EMC compliance, materials engineering, and large-scale manufacturing/NPI execution. You will work cross-functionally with optics, signal integrity, electrical, thermal, manufacturing, reliability, and supplier teams to deliver high-performance products at hyperscale production volumes. Key ResponsibilitiesLead end-to-end mechanical design and development of OSFP transceiver modules and related hardwareDefine module architecture, stack-up strategy, mechanical interfaces, retention mechanisms, heat spreaders, cages, and thermal pathsDesign precision components using sheet metal, die castings, injection molded plastics, CNC machined parts, and TIMsOptimize designs for thermal performance, structural integrity, EMI shielding effectiveness, manufacturability, reliability, and costDrive advanced thermal solutions for high-power DSP and optical engines(Optional) Perform thermal simulations using FloTHERM, Icepak, and CFD toolsDevelop cooling strategies involving heat sinks, vapor chambers, heat spreaders, liquid cooling interfaces, and advanced TIM selectionLead reliability validation including thermal cycling, mechanical shock/drop, vibration, HALT/HASS, and environmental testingDefine GD&T strategy and tolerance stack-up analysis for critical thermal and optical interfacesDesign EMI shielding solutions including conductive gaskets, coatings, and grounding strategiesDrive NPI activities from concept through mass productionEstablish DFM/DFA guidelines, assembly processes, quality controls, and automation opportunitiesLead supplier qualification and manufacturing transfer activitiesSupport yield improvement and root-cause analysis using 8D, DMAIC, Fishbone, and DFMEA/PFMEAMentor and technically lead engineering teams Required QualificationsBachelor’s or Master’s degree in Mechanical Engineering or related field12–20+ years of experience in optical transceivers, networking systems, semiconductor packaging, or data center hardwareStrong expertise in OSFP/QSFP mechanical systems, thermal management, and precision designProficiency in Creo, SolidWorks, or NX CAD toolsStrong understanding of GD&T, tolerance analysis, material science, EMI/EMC, and reliability engineering Preferred QualificationsExperience with 800G/1.6T optical modulesKnowledge of co-packaged optics or near-packaged opticsExperience with copper alloys, Zamak die casting, advanced TIMs, and thermal materialsFamiliarity with OSFP MSA specifications and high-volume manufacturing modelsSix Sigma certification or patent publications preferred Key SkillsMechanical architecture leadershipThermal design & simulation (optional)NPI & manufacturing transferSupplier managementCost optimization / should-cost analysisDFMEA / PFMEARoot cause analysisProgram leadershipExecutive-level technical presentation skills Ideal Background / IndustriesOptical networkingHyperscale data centersSemiconductor systemsTelecom infrastructureAI server platformsHigh-speed interconnect products What We OfferCompetitive salary and significant equity in a...