Process Engineer – Wafer Bumping, Wafer Singulation, Wafer Grinding & Wafer Mounting

## Company: RF360 Singapore Pte., Ltd. ## Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Job Summary: We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality, efficiency, productivity, yield, cycle time, and safety requirements. This role is ideal for an engineer who enjoys data-driven problem solving, continuous improvement, and working closely with cross-functional teams in a fast-paced manufacturing environment. Key Responsibilities: Process Engineering & Manufacturing Support * Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting. * Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets. * Monitor and analyse process data to identify trends, risks, and improvement opportunities. * Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues. * Drive permanent corrective and preventive actions to resolve chronic process and quality issues. * Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release. * Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution. Documentation, Compliance & Audit Support * Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents. * Prepare production lines and process documentation for internal and external audits. * Support audit follow-up actions and ensure timely closure of findings. * Promote compliance with safety, quality, and manufacturing standards. Continuous Improvement * Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness. * Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable. * Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence. Qualifications: * Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline. * Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing. * Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered. Required Skills & Competencies: * Strong data analysis, problem-solving, and critical thinking skills. * Good communication and collaboration skills, with the ability to work effectively with cross-functional teams. * Good planning, organization, and follow-up skills. * Ability to work under pressure and demonstrate strong commitment to achieving production and quality...