Staff Product Manager - Data Center High-Speed Connectivity & AI Infrastructure

## Company: Qualcomm Technologies, Inc. ## Job Area: Operations Group, Operations Group > Product Management General Summary: Join Qualcomm's Data Center Business Unit and help define the next generation of high-performance connectivity solutions powering hyperscale AI infrastructure. As a Staff Product Manager, you will drive product strategy, roadmap definition, customer engagement, and execution for high-speed connectivity technologies that enable AI scale-up and scale-out systems. Working across architecture, engineering, ecosystem partners, and hyperscale customers, you will help shape solutions spanning scale-up fabrics, high-speed I/O, optical networking, and rack-scale infrastructure. Qualcomm's connectivity portfolio includes advanced Serdes, optical, PCIe, and next-generation interconnect technologies that support scalable AI systems and custom silicon platforms. Product Strategy & Roadmap * Define product strategy and multi-generation roadmaps for high-speed connectivity solutions supporting AI and cloud infrastructure. * Develop market requirements, customer use cases, competitive positioning, and business cases for next-generation connectivity technologies. * Identify emerging industry trends and customer requirements across AI networking, scale-up fabrics, scale-out architectures, chiplet ecosystems, and rack-scale infrastructure. * Drive platform and ecosystem strategies that enable broad adoption across custom silicon and AI infrastructure deployments. Customer Engagement * Engage directly with customers, ecosystem partners, and industry consortiums to understand future connectivity requirements. * Translate customer needs into product requirements and roadmap priorities. * Support technical workshops, architecture reviews, customer briefings, and executive engagements. * Develop compelling product value propositions and positioning for strategic customer opportunities. Architecture & Cross-Functional Leadership * Collaborate closely with architecture and engineering teams to define system-level connectivity requirements and product capabilities. * Drive alignment across silicon, software, systems, packaging, and infrastructure organizations. * Provide product leadership for emerging interconnect technologies including die-to-die connectivity, chiplet ecosystems, scale-up fabrics, high-speed I/O, and optical networking solutions. Qualcomm's platform strategy includes advanced electrical and optical interconnect technologies as key building blocks for future data center platforms. * Balance performance, scalability, power efficiency, cost, ecosystem adoption, and business objectives when defining product direction. Business & Execution * Develop business cases, investment recommendations, pricing strategies, and customer engagement plans. * Support product planning from concept through market deployment and adoption. * Drive cross-functional execution across architecture, engineering, operations, sales, and marketing. * Track product success using measurable business, customer, and execution metrics. This is an office based position located in Santa Clara, CA and is expected to comply with the company's onsite work policy. Minimum Qualifications: • Bachelor's degree in Engineering, Information Systems, Computer Science, Humanities, or related field. • 5+ years of Product Management or related work experience. Preferred Qualifications: * 10+ years of experience in semiconductor, networking, connectivity, or AI infrastructure markets. * Strong understanding of high-speed connectivity technologies including PCIe, Ethernet, optical interconnects, die-to-die communication, and chiplet ecosystems. * Experience with AI infrastructure, hyperscale data centers, HPC systems, or cloud architectures. * Understanding of scale-up and scale-out system architectures used in AI and machine learning deployments. * Familiarity with advanced packaging, heterogeneous integration, and...