Principal PCB Engineer – Datacenter / High-Speed Systems

## Company: Qualcomm Technologies, Inc. ## Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms. This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement, supporting both NPI and volume production while shaping Qualcomm’s future hardware roadmap. Key Responsibilities 1\. PCB Design & Manufacturing Readiness * Hands on experience with PCB process including defining and drive PCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenter PCB boards * Develop and maintain DFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability * Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability 2\. Supplier Engagement & Capability Validation * Engage with PCB manufacturers (fabricators & assemblers) to: * Understand design rule capability (trace/space, via structures, stack-up complexity, materials) * Evaluate BOM capability including advanced laminates, low-loss materials, and new technologies * Collect and analyze supplier data to validate manufacturing capability vs design requirements * Drive multi-source strategy and supplier qualification for high-volume production 3\. NPI & Manufacturing Support * Support critical NPI builds for datacenter platforms (AI/Compute PCB boards, high-power systems) * Troubleshoot PCB fabrication / assembly issues: * Yield excursions * Reliability failures * Process limitations * Lead root cause analysis and implement corrective & preventive actions (CAPA) 4\. Technology Roadmap Development * Drive PCB technology roadmap in collaboration with suppliers: * Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.) * New materials (low-loss, high-Tg, ultra-thin core, glass core evolution) * High layer count / ultra-high density interconnect solutions * Pioneer and implement new structures, technologies, and BOM solutions to advance Qualcomm’s platform capability 5\. Industry & Competitive Intelligence * Monitor industry trends (Datacenter, AI infrastructure, high-speed PCB technology) * Perform competitive benchmarking (Hyperscalers, ODM ecosystem, etc.) * Identify emerging strategies to ensure Qualcomm remains aligned with leading-edge technology directions Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience. Preferred Qualifications: * BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field * 15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred) ​​Strong understanding of: * High-speed design fundamentals (SI/PI, loss, impedance control) * Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles) * PCB materials (low-loss laminates/Core & PPG, Cu foil, Plating chemistry, SR, Surface Finish, etc.) * Experience working directly with PCB suppliers (fab + assembly/CM) * Proven track record in NPI builds and manufacturing issue resolution * Experience with AI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred) * Familiarity with...